Overview

Semiconductors are the core components of modern electronic devices, and the semiconductor industry holds a crucial position in modern technology and industry.

Cases
VMZ Zenith
Packaging Precision Measurement
Measurement Challenge

Surface-mounting and bonding are critical steps in the semiconductor back-end process. The accuracy of surface-mounting and bonding directly affects the device's performance.

Solution

Video measuring machine equipped with automatic zoom lenses, high-magnification microscope lenses, and spectroscopic confocal sensors. The automatic zoom lens enables fast product identification, positioning, and serial number extraction; the high-magnification microscope lens is used for measuring fine features; the spectroscopic confocal sensor is used for measuring height, flatness, or warping.

VMG Gantry
Sprayer Nozzle Measurement
Measurement Challenge

The sprayer nozzle is a key component of CVD (Chemical Vapor Deposition) equipment, through which reactive gases enter the reaction chamber via thousands of small holes on its surface. The machining accuracy of these holes determines the uniformity and quality of the film. Due to the large number of holes, a high-speed, high-precision measurement solution is required.

Solution

Conventional video measuring measurement involves a cyclic process of "moving the workbench to position, the camera system capturing the measured feature, then moving the workbench to the next position." In flying-snap mode, the workbench moves while simultaneously capturing the features, without pauses, allowing for efficient measurement. The small holes on the sprayer nozzle surface are typically arranged in concentric circular patterns, and the flying-snap function supports also circular paths.

VMU Ultra
Sputtering Target Flatness Measurement
Measurement Challenge

Magnetron sputtering is a type of physical vapor deposition (PVD) commonly used for depositing conductive, insulating, and protective films. During the sputtering process, argon ions are accelerated by an electric field and bombard the target, causing neutral atoms or molecules on the target's surface to gain sufficient energy to detach and deposit onto the substrate, forming a thin film. The target material must meet requirements for purity, thermal conductivity, and flatness to ensure the uniformity and density of the deposited film.

Solution

Video measuring machine equipped with a spectroscopic confocal sensor, measures the flatness of the target surface. As this is an optical, non-contact measurement method, it offers high precision, fast measurement speed, and no damage to the target surface.

CMU Ultra
Silicon Carbide Structural Part Measurement
Measurement Challenge

Silicon carbide (SiC) materials are known for their high hardness, wear resistance, strength, thermal stability, and chemical stability. They are often used in components such as lithography machine worktables, wafer handling arms, and reaction chamber parts.

Solution

The Coordinate Measuring Machine (CMM), equipped with a rotary worktable, performs full-size, high-precision measurements of silicon carbide structural parts.

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