Patterning LDI Equipment

TZDI Patterning Laser Direct Imaging (LDI) Equipment features a sub-micron precision motion control stage, next-gen DMD, and advanced optical imaging.

Enhanced by TZTEK's proprietary vision, calibration, and compensation algorithms, it delivers superior imaging quality, throughput, and alignment accuracy. Ideal for patterning in applications such as MLB, HDI, FPC.

Training Certificate Inquiry

Scroll to explore

Advantages

High Precision
Advanced Functionality
High Throughput
Smart System

High Precision

Alignment accuracy: ±5 μm
Minimum line width/spacing: 4/4 μm
Advanced Functionality

Zone alignment & shrinkage compensation
Automated accuracy measurement
Real-time energy fluctuation compensation, reducing manual intervention
High Throughput

30% faster data processing with next-gen DMD control technology
50% faster alignment via high-speed flying exposure
Equipped with a high-power laser up to 100W
Smart System

Customizable MES for real-time equipment monitoring
PC/mobile alerts and notifications

PRODUCT SPECIFICATIONS

TZDI-40
TZDI-35
TZDI-25
TZDI-12

- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025 - 6 mm
- Minimum Line Width/Spacing
  
  40 μm
- Typical Production Line Width/Spacing(μm)
  
  60 μm
- Line Width Tolerance
  
  ±10%
- Alignment Accuracy
  
  ±12 μm
- Interlayer Registration Accuracy
  
  24 μm
- Depth of Field
  
  ±300 μm
- Single-Machine Throughput
  
  8.5 s/side @20 mJ/cm²
- Automatic Line Throughput
  
  7 s/pnl @20 mJ/cm²
- Recommended Applications
  
  MLB (inner & outer layers), Ceramic Substrate
- More Information
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025 - 6 mm
- Minimum Line Width/Spacing
  
  35 μm
- Typical Production Line Width/Spacing
  
  50 μm
- Line Width Tolerance
  
  ±10%
- Alignment Accuracy
  
  ±10 μm
- Interlayer Registration Accuracy
  
  20 μm
- Depth of Field
  
  ±300 μm
- Single-Machine Throughput
  
  8.5 s/side @20mj/cm²
- Automatic Line Throughput
  
  7 s/ pnl @20mj/cm²
- Recommended Applications
  
  MLB (inner & outer layers), Ceramic Substrate
- More Information
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 850 mm
- Substrate Thickness
  
  0.025 to 6 mm
- Minimum Line Width/Spacing
  
  25 μm
- Typical Production Line Width/Spacing
  
  40 μm
- Line Width Tolerance
  
  ±10%
- Alignment Accuracy
  
  ±10 μm
- Interlayer Registration Accuracy
  
  20 μm
- Depth of Field
  
  ±200 μm
- Single-Machine Throughput
  
  10 s/side @20mj/cm²
- Automatic Line Throughput
  
  8 s/pnl @20mj/cm²
- Recommended Applications
  
  MLB(inner & outer layers), HDI
- More Information
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025 to 6 mm
- Minimum Line Width/Spacing
  
  12 μm
- Typical Production Line Width/Spacing
  
  20 μm
- Line Width Tolerance
  
  ±10%
- Alignment Accuracy
  
  ±7 μm
- Interlayer Registration Accuracy
  
  16 μm
- Depth of Field
  
  ±150 μm
- Single-Machine Throughput
  
  12 s/side @20mj/cm²
- Automatic Line Throughput
  
  12 s/pnl @20mj/cm²
- Recommended Applications
  
  IC Substrate, SLP
- More Information

RELATED PRODUCTS

Roll-to-Roll LDI Equipment

Designed to overcome the challenges of roll-to-roll processing, the TZDI series features a ultra-precision gantry motion control platform delivering submicron accuracy.

Solder Mask LDI Equipment

TZTEK solder mask LDI combines advanced laser/UVLED and multi-wavelength laser technologies to overcome the solder mask challenges on high-end PCBs like IC substrates.

IC Substrate LDI Equipment

The TZDI LDI system is engineered to meet the stringent precision demands of carrier board exposure processes, including circuit and solder mask patterning. Its ultra-precision air-bearing motion control platform delivers 100-nanometer positioning accuracy. Featuring a high-precision illumination and projection lithography imaging system, the equip

Automatic LDI Line

TZTEK’s automatic line features proprietary dual-machine or single-machine dual-table designs tailored for high-volume production of rigid (circuit/solder mask) and flexible PCBs.