Solder Mask LDI Equipment

TZTEK solder mask LDI combines advanced laser/UVLED and multi-wavelength laser technologies to overcome the solder mask challenges on high-end PCBs like IC substrates.

Supporting a wide range of inks and dry/wet film processes, it seamlessly integrates into automated production lines, delivering high-precision, stable solder mask patterning that boosts efficiency and reduces costs.

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Advantages

High Precision
Advanced Functionality
High Throughput
Smart System

High Precision

Alignment accuracy：±5 μm
Minimum solder mask bridge/SRO：40 μm/60 μm
Advanced Functionality

Zone alignment & shrinkage compensation
Multi-wavelength hybrid light source technology (UVLED & LD) compatible with various ink types and dry/wet film processes
Real-time energy fluctuation compensation, reducing manual intervention
High Throughput

30% faster data processing with next-gen DMD control technology
Enhanced equipment utilization with dual-table design
Equipped with a high-power multi-wavelength laser up to 150W
Smart System

Customizable MES system for real-time equipment monitoring
PC/mobile alerts and notifications

PRODUCT SPECIFICATIONS

DI35 Series - UVLED
DI10 Series - UVLED
DI20 Series - UVLED
DI35 High Speed Series
DI10 High Precision Series
DI20 High Precision Series

- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  625 mm ×810 mm
- Substrate Thickness
  
  0.025 - 6 mm
- Minimum Solder Mask Opening
  
  100 μm
- Minimum Solder Mask Bridge
  
  75 μm
- Solder Mask Opening Accuracy
  
  ±10%
- Alignment Accuracy
  
  ±12 μm
- Depth of Field
  
  ±150 μm
- Single-Machine Throughput
  
  25 s/side @500mj/cm²
- Automatic Line Throughput
  
  25 s/pnl @500mj/cm²
- Recommended Applications
  
  MLB, HDI, FPC
- More Information
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025 - 10 mm
- Minimum Solder Mask Opening
  
  50 μm
- Minimum Solder Mask Bridge
  
  30 μm
- Solder Mask Opening Accuracy
  
  ±10%
- Alignment Accuracy
  
  ±6 μm
- Depth of Field
  
  ±75 μm
- Single-Machine Throughput
  
  50 s/side @500mj/cm²
- Automatic Line Throughput
  
  50 s/pnl @500mj/cm²
- Recommended Applications
  
  ICS, SLP
- More Information
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  612 mm × 810 mm
- Substrate Thickness
  
  0.025 - 10 mm
- Minimum Solder Mask Opening
  
  60 μm
- Minimum Solder Mask Bridge
  
  40 μm
- Solder Mask Opening Accuracy
  
  ±10%
- Alignment Accuracy
  
  ±8 μm
- Depth of Field
  
  ±150 μm
- Single-Machine Throughput
  
  40 s/side @500mj/cm²
- Automatic Line Throughput
  
  40 s/pnl @500mj/cm²
- Recommended Applications
  
  IS, SLP, HDI
- More Information
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  626 mm × 810 mm
- Substrate Thickness
  
  0.025 - 6 mm
- Minimum Solder Mask Opening
  
  75 μm
- Minimum Solder Mask Bridge
  
  50 μm
- Solder Mask Opening Accuracy
  
  ±10%
- Alignment Accuracy
  
  ±12 μm
- Depth of Field
  
  ±300 μm
- Single-Machine Throughput
  
  12 s/side @500mj/cm²
  21s/side @1000mj/cm²
- Automatic Line Throughput
  
  12 s/pnl @500mj/cm²
  21s/pnl @1000mj/cm²
- Recommended Applications
  
  MLB, HDI, FPC
- More Information
- Platform Type
  
  Single-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025 - 10 mm
- Minimum Solder Mask Opening
  
  50 μm
- Minimum Solder Mask Bridge
  
  30 μm
- Solder Mask Opening Accuracy
  
  ±10%
- Alignment Accuracy
  
  ±6 μm
- Depth of Field
  
  ±100 μm
- Single-Machine Throughput
  
  38 s/side @500mj/cm²
- Automatic Line Throughput
  
  38 s/pnl @500mj/cm²
- Recommended Applications
  
  ICS, SLP
- More Information
- Platform Type
  
  Single-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025 - 10 mm
- Minimum Solder Mask Opening
  
  60 μm
- Minimum Solder Mask Bridge
  
  40 μm
- Solder Mask Opening Accuracy
  
  ±10%
- Alignment Accuracy
  
  ±8 μm
- Depth of Field
  
  ±150 μm
- Single-Machine Throughput
  
  20 s/side @500mj/cm²
- Automatic Line Throughput
  
  20 s/pnl @500mj/cm²
- Recommended Applications
  
  ICS, SLP, HDI
- More Information

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