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MT3000VIS/UV/IR
A high-precision optical metrology platform covering processes from wafer fabrication to advanced packaging.
The MT3000 series is a versatile optical metrology platform designed for the full process flow of semiconductor manufacturing. It supports automatic measurement of critical parameters on wafers up to 200mm, including critical dimension(CD), overlay error, and thin film thickness.
The system is widely applicable to various process steps, from front-end wafer manufacturing to back-end advanced packaging, fulfilling the verification needs in R&D and quality control requirements in high-volume manufacturing. The system is equipped with a high-efficient fully automated wafer handling system, delivering a comprehensive, high-throughput metrology solution.
The system is widely applicable to various process steps, from front-end wafer manufacturing to back-end advanced packaging, fulfilling the verification needs in R&D and quality control requirements in high-volume manufacturing. The system is equipped with a high-efficient fully automated wafer handling system, delivering a comprehensive, high-throughput metrology solution.
With over 10 years of continuous optimization and validation across global customer applications, the system offers high maturity and reliability, making it a preferred platform for wafer manufacturing and packaging metrology.
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Advantages
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Integrated Measurement Capabilities
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Flexible and User-Friendly
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Mature, Stable, and Reliable
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Integrated Measurement CapabilitiesMulti-metrology functions can be integrated as needed to support products of various wafer sizes
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Flexible and User-FriendlyOffers customizable software features and flexible, on-demand configurations
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Mature, Stable, and ReliableLow cost of ownership, easy maintenance, and no short-lifecycle consumables and long-term operational stability and reliability
