IC Substrate LDI Equipment

The TZDI LDI system is engineered to meet the stringent precision demands of carrier board exposure processes (circuit & solder mask). Its ultra-precision air-bearing motion control platform delivers 100-nanometer positioning accuracy. Featuring a high-precision illumination and projection lithography imaging system, the equipment ensures outstanding exposure pattern fidelity. An advanced environmental control system reduces the effects of environmental variations, maintaining stable and reliable operation.

Innovatively integrated with TZTEK's proprietary high-throughput data processing solution, the system significantly boosts data handling efficiency. Multi-wavelength hybrid light source technology supports diverse ink exposure requirements, while active focus control compensates dynamically for substrate deformation. The cutting-edge technologies achieves an optimal balance of high productivity and exceptional quality, making the TZDI series ideal for demanding applications such as SLP, IC substrates, HDI (mSAP), and other advanced products requiring precise circuit and solder mask pattern transfer.

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Advantages

High Precision
Advanced Functionality
High Throughput
Smart System

High Precision

Alignment accuary: ±5μm
Minimum line wdith: L/S=4/4μm
Advanced Functionality

Zone alignment & shrinkage compensation
Automated accuracy measurement
Real-time energy fluctuation compensation, reducing manual intervention
High Throughput

30% faster data processing with next-gen DMD control technology
50% faster alignment via high-speed flying exposure
Equipped with a high-power laser up to 100W
Smart System

Customizable MES for real-time equipment monitoring
PC/mobile alerts and notifications

PRODUCT SPECIFICATIONS

TZDI-6
TZDI-4

- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm x 660 mm
- Substrate Thickness
  
  0.025 - 6 mm
- Minimum Line Width/Spacing
  
  6 μm
- Typical Production Line Width/Spacing
  
  12 μm
- Line Width Tolerance
  
  ±1 μm
- Alignment Accuracy
  
  ±6 μm
- Interlayer Registration Accuracy
  
  10 μm
- Depth of Field
  
  ±150 μm
- Single-Machine Throughput
  
  30 s/side @20mj/cm²
- Automatic Line Throughput
  
  30 s/pnl @20mj/cm²
- Recommended Applications
  
  IC substrate
- More Information
- Platform Type
  
  Single-table
- Maximum Exposure Area
  
  630 mm × 510 mm
- Substrate Thickness
  
  0.025 - 6 mm
- Minimum Line Width
  
  4/4 μm
- Typical Production Line Width/Spacing
  
  8/8 μm
- Line Width Tolerance
  
  ±0.75 μm
- Alignment Accuracy
  
  ±5 μm
- Interlayer Alignment Accuracy
  
  10 μm
- Depth of Field
  
  ±200 μm (Optional Active Focusing)
- Single-Machine Throughput
  
  50 s/side @100mj/cm²
- Recommended Applications
  
  ICS, SLP
- More Information

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