We use cookies to personalise and enhance your experience when using our website. By continuing to visit this site, you agree to our use of cookies as described in TZTEK's Privacy Policy.

半导体芯片_存储芯片制程-02.jpg 半导体芯片_存储芯片制程-08.jpg

Darkfield Inspection

BFI.jpg

INDUSTRY SOLUTION

  • Supports a 266 nm inspection wavelength to significantly improve sensitivity to small defects.

  • GDS-based ROI definition improves ROI accuracy, enhances defect SNR, and suppresses noise from non-critical areas.

  • Advanced AI algorithms further optimize defect signal analysis.

  • Combines a high-speed motion stage with HPC to accelerate wafer handling and data processing, increasing overall WPH throughput for high-volume manufacturing.

KEY ADVANTAGES

  • 1.svg

    GDS ROI Technology: Higher ROI accuracy with lower inspection noise.

  • 带AI标.svg

    AI Algorithms & Data Analytics: Intelligent inspection, noise suppression, and support for diverse applications.

  • 2.svg

    High-Speed Motion stage: Faster motion improves overall inspection throughput.

RELATED SOLUTIONS

Fill out the form to get more information
  • Verification code *
  • I have read and agree to TZTEK"Privacy Policy".
  • CONTACT US
The information has been submitted successfully.

We will contact you as soon as possible. Thank you for your understanding and support of Tianzhun.

OK