Microvia & Through-Hole Drilling (HDI, IC Substrates, Rigid-flex)
INDUSTRY CHALLENGES
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01High-density PCB manufacturing demands tighter control of drilling accuracy and consistency.
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02
Advanced HDI designs require smaller microvias and tighter hole-size tolerances.
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03
Smart manufacturing requires real-time equipment monitoring, production data visibility, and intelligent equipment management.
INDUSTRY SOLUTION
Laser drilling plays a key role in multilayer PCB manufacturing, with hole accuracy, hole-wall quality, and throughput directly affecting product quality, reliability, and yield.
TZTEK's CO₂ laser drilling combines high-speed galvo scanning, precision motion control, and proprietary calibration, zoning, and path-planning algorithms to achieve drilling accuracy within 20 μm.
A high-performance CO₂ laser and optical system enable stable, high-volume drilling of 50 μm microvias.
Integrated equipment controls provide real-time production and equipment data, with built-in analytics and IoT interfaces for smart manufacturing.
KEY ADVANTAGES
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High-precision drilling enabled by domestically developed technology.
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Intelligent, stable operation with integrated closed-loop control.
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On-site and remote technical support with preventive maintenance services.
