Brightfield Inspection
INDUSTRY SOLUTION
Designed to address the inspection challenges in memory processes, TZTEK's brightfield defect inspection solution integrates multiple technologies to support high-precision in-line inspection of thick films and high-density memory structures.
The system supports an extended focus range, improving inspection coverage and defect detection within thick film layers.
A minimum inspection pixel size of 36 nm enhances small-defect detection, while a 3 × 3 pixel high-precision scan region improves detection accuracy and reduces noise.
The system supports multi-material optical simulation and full-wave time-domain simulation based on actual process structures, covering wavelengths from 260–600 nm to optimize inline inspection.
A high-speed motion stage synchronizes continuous motion with TDI to reduce step-and-settle time. Combined with HPC, it improves data processing efficiency for stable, high-precision, high-throughput production.
KEY ADVANTAGES
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AI Algorithms & Data Analytics: Intelligent inspection, noise suppression, and support for diverse applications.
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Large Focus Range Inspection: Extended Z-axis travel accommodates a wide range of focus requirements.
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Optical Simulation & Design: Professional simulation engines and comprehensive material libraries enable rapid optical design iteration and optimization.
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High-Speed Precision Motion Stage: Faster motion improves overall inspection throughput.
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GDS ROI Technology: Higher ROI accuracy with lower inspection noise.
