IC Substrate LDI Equipment
Training Certificate Inquiry
Advantages
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High Precision
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Powerful Functions
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High Throughput
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Intelligent Operation
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High PrecisionRegistration accuracy up to ±5 μm
Minimum line/space down to 4/4 μm
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Powerful FunctionsActive autofocus for dynamic substrate deformation compensation
Hybrid UV LED and laser light source technology for a wide range of solder mask curing requirements in package substrate manufacturing
Real-time laser energy monitoring with automatic compensation
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High ThroughputHigh-throughput data processing solution
Simultaneous multi-camera registration for improved multi-zone registration efficiency
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Intelligent OperationCustomizable MES integration for real-time equipment management
PC and mobile-based alarms and notifications
PRODUCT SPECIFICATIONS
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TZDI-06
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TZDI-04
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Platform Type
Dual-table
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Maximum Exposure Area
630 mm x 810 mm
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Substrate Thickness
0.025-6 mm
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Minimum Line/Space
6 μm
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Line Width Tolerance
±1 μm
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Registration Accuracy
±6 μm
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Interlayer Registration Accuracy
12 μm
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Depth of Foucs
±75 μm
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Standalone Throughput
30 s/side @ 20 mJ/cm²
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Inline Throughput
30 s/panel @ 20 mJ/cm²
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Recommended Applications
IC substrate
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Platform Type
Single-table
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Maximum Exposure Area
630 mm × 610 mm
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Substrate Thickness
0.025-5 mm
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Minimum Line Width
4/4 μm
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Line Width Tolerance
±0.75 μm
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Registration Accuracy
±5 μm
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Interlayer Registration Accuracy
10 μm
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Depth of Focus
±200 μm (Optional Active Focusing)
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Standalone Throughput
60 s/side @100 mJ/cm²
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Recommended Applications
ICS, SLP
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