MT3000VIS/UV/IR
High-Precision Optical Metrology Platform for Wafer Fabrication and Advanced Packaging
The MT3000 series is a versatile optical metrology platform designed for semiconductor manufacturing. It enables automatic measurement of key parameters on wafers up to 200 mm, including critical dimension (CD), overlay, and thin-film thickness.
The system supports a wide range of applications, from front-end wafer fabrication to back-end advanced packaging, meeting the needs of both R&D process development and high-volume manufacturing quality control. Equipped with a high-throughput automated wafer handling system, it delivers efficient, reliable metrology for high-volume manufacturing.
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Advantages
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Integrated Metrology
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Flexible and Easy to Use
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Proven and Reliable
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Integrated MetrologySupports multiple metrology modules and a wide range of product sizes
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Flexible and Easy to UseCustomizable software functions and system configurations for diverse applications
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Proven and ReliableLow Cost of Ownership, easy maintenance, and no consumables requiring regular replacement
