TB1500
For 55-40 nm technology nodes
Compatible with 8-inch/12-inch wafers
Compatible with 8-inch/12-inch wafers
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Advantages
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High Sensitivity
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High Throughput
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Intelligent Software Support
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Independent & Controllable Supply Chain
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High SensitivityDefect detection down to 60 nm
Advanced signal processing for enhanced signal-to-noise ratio
Broadband illumination for comprehensive defect capture
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High ThroughputHigh data rate
Multiple pixel size options
Optimized for high-speed scanning
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Intelligent Software SupportOnline Smart Defect Classification (SDA)
Process Window Verification
Design Care Area Support
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Independent & Controllable Supply ChainHigh-Throughput DUV Imaging System
High-speed deep ultraviolet TDI Camera
High-power LSP light source
Ultra-Precision Motion Stage
