Circuit Patterning LDI Equipment

Combines a sub-micron precision motion platform, next-generation DMD control, and advanced optical imaging with proprietary vision, calibration, and compensation algorithms for superior imaging quality, throughput, and alignment accuracy.

Optimized for circuit pattern imaging in MLB, HDI, FPC and related applications, it enables reliable, high-precision image transfer across a wide range of PCB manufacturing processes.

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Advantages

High Precision
Powerful Functions
High Throughput
Intelligent Operation

High Precision

Registration accuracy up to ±5 μm
Minimum line/space: 4/4 μm
Powerful Functions

Multi-zone registration and panel expansion/shrinkage compensation
Automatic accuracy verification
Real-time energy monitoring and automatic compensation
High Throughput

Next-generation DMD technology with 30%+ faster data processing
High-speed on-the-fly imaging for 50% faster registration
High-power single laser source up to 100 W
Intelligent Operation

Customizable MES integration for real-time equipment management
PC and mobile-based alarms, and notifications

PRODUCT SPECIFICATIONS

TZDI-40
TZDI-35
TZDI-25
TZDI-20
TZDI-12

- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025-10 mm
- Minimum Line/Space
  
  40 μm
- Production Line/Space
  
  60 μm
- Line Width Tolerance
  
  ±10%
- Registration Accuracy
  
  ±12 μm
- Layer-to-Layer Registration Accuracy
  
  24 μm
- Depth of Focus
  
  ±300 μm
- Standalone Throughput
  
  8.5 s/side @20 mJ/cm²
- Inline Throughput
  
  7 s/panel @ 20 mJ/cm²
- Recommended Applications
  
  MLB (inner & outer layers), Ceramic Substrate
- More Information
- More Products
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025-10 mm
- Minimum Line/Space
  
  35 μm
- Production Line/Space
  
  50 μm
- Line Width Tolerance
  
  ±10%
- Registration Accuracy
  
  ±10 μm
- Layer-to-Layer Registration Accuracy
  
  20 μm
- Depth of Focus
  
  ±300 μm
- Standalone Throughput
  
  8.5 s/side @20 mJ/cm²
- Inline Throughput
  
  7.5 s/panel @ 20 mJ/cm²
- Recommended Applications
  
  MLB (inner & outer layers), Ceramic Substrate
- More Information
- More Products
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 850 mm
- Substrate Thickness
  
  0.025-10 mm
- Minimum Line/Space
  
  25 μm
- Production Line/Space
  
  40 μm
- Line Width Tolerance
  
  ±10%
- Registration Accuracy
  
  ±10 μm
- Layer-to-Layer Registration Accuracy
  
  20 μm
- Depth of Focus
  
  ±200 μm
- Standalone Throughput
  
  10 s/side @20 mJ/cm²
- Inline Throughput
  
  8 s/panel @ 20 mJ/cm²
- Recommended Applications
  
  MLB(inner & outer layers), HDI, FPC
- More Information
- More Products
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025-10 mm
- Minimum Line/Space
  
  20 μm
- Production Line/Space
  
  35 μm
- Line Width Tolerance
  
  ±10%
- Registration Accuracy
  
  ±8 μm
- Layer-to-Layer Registration Accuracy
  
  16 μm
- Depth of Focus
  
  ±150 μm
- Standalone Throughput
  
  10 s/side @20 mJ/cm²
- Inline Throughput
  
  8.5 s/panel @ 20 mJ/cm²
- Recommended Applications
  
  FPC, HDI
- More Information
- More Products
- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025-10 mm
- Minimum Line/Space
  
  12 μm
- Production Line/Space
  
  25 μm
- Line Width Tolerance
  
  ±10%
- Registration Accuracy
  
  ±7 μm
- Layer-to-Layer Registration Accuracy
  
  16 μm
- Depth of Focus
  
  ±150 μm
- Standalone Throughput
  
  12 s/side @20 mJ/cm²
- Inline Throughput
  
  12 s/panel @ 20 mJ/cm²
- Recommended Applications
  
  IC Substrate, SLP, FPC
- More Information
- More Products

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