Solder Mask LDI Equipment

TZTEK solder mask LDI equipment integrates laser/UVLED and multi-wavelength laser technologies to address diverse solder mask process challenges. Fully compatible with mainstream inks and dry/wet film processes, it seamlessly integrates into automated production lines.

This enables high-precision, high-stability solder mask patterning that significantly improves yield rates while reducing overall costs. The system is ideally suited for solder mask imaging on MLB, HDI, FPC, and other advanced PCB applications.

Training Certificate Inquiry

Scroll to explore

Advantages

High Precision
Powerful Functions
High Throughput
Intelligent Operation

High Precision

Registration accuracy up to ±8 μm
Minimum solder mask bridge/opening: 40 μm / 60 μm
Powerful Functions

Multi-zone registration and panel expansion/shrinkage compensation
Hybrid UV LED and laser light source technology compatible with a wide range of solder mask inks and dry/wet-film processes
Real-time energy monitoring and automatic compensation
High Throughput

Next-generation DMD technology with 30%+ faster data processing
Dual-table exposure for increased equipment utilization
High-power multi-wavelength laser source up to 150 W
Intelligent Operation

Customizable MES integration for real-time equipment management
PC and mobile-based alarms and notifications

PRODUCT SPECIFICATIONS

DI35 High Speed Series
DI10 High Precision Series
DI20 High Precision Series

- Platform Type
  
  Dual-table
- Maximum Exposure Area
  
  626 mm × 810 mm
- Substrate Thickness
  
  0.025-10 mm
- Minimum Solder Mask Opening
  
  75 μm
- Minimum Solder Mask Bridge
  
  50 μm
- Opening Size Tolerance
  
  ±10%
- Registration Accuracy
  
  ±12 μm
- Depth of Focus
  
  ±300 μm
- Standalone Throughput
  
  12 s/side @ 500 mJ/cm²
  21 s/side @ 1000 mJ/cm²
- Inline Throughput
  
  12 s/panel @ 500 mJ/cm²
  21 s/panel @ 1000 mJ/cm²
- Recommended Applications
  
  MLB, HDI, FPC
- More Information
- More Products
- Platform Type
  
  Single-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025-10 mm
- Minimum Solder Mask Opening
  
  40 μm
- Minimum Solder Mask Bridge
  
  30 μm
- Opening Size Tolerance
  
  ±10%
- Registration Accuracy
  
  ±6 μm
- Depth of Focus
  
  ±100 μm
- Standalone Throughput
  
  60 s/side @ 500 mJ/cm²
- Inline Throughput
  
  60 s/panel @ 500 mJ/cm²
- Recommended Applications
  
  ICS, SLP
- More Information
- More Products
- Platform Type
  
  Single-table
- Maximum Exposure Area
  
  630 mm × 810 mm
- Substrate Thickness
  
  0.025-10 mm
- Minimum Solder Mask Opening
  
  60 μm
- Minimum Solder Mask Bridge
  
  40 μm
- Opening Size Tolerance
  
  ±10%
- Registration Accuracy
  
  ±8 μm
- Depth of Focus
  
  ±150 μm
- Standalone Throughput
  
  20 s/side @ 500 mJ/cm²
- Inline Throughput
  
  20 s/panel @ 500 mJ/cm²
- Recommended Applications
  
  ICS, SLP, HDI
- More Information
- More Products

RELATED PRODUCTS

Circuit Pattern LDI Equipment

Roll-to-Roll LDI Equipment

IC Substrate LDI Equipment

Automatic LDI Line